In the era of rapid technological advancement, the performance of power electronics equipment is constantly improving, and the power density is continuously increasing. Among them, High Power IGBT (Insulated Gate Bipolar Transistor), as a core device, is widely applied in numerous key fields, such as electric vehicles, industrial automation, smart grids, and new energy power generation. However, with the increase in IGBT power, the heat generated also rises sharply. An efficient heat dissipation solution has become crucial for ensuring the stable operation and performance optimization of equipment. The High Power IGBT Cooling Plate has emerged as the times require and is gradually becoming the focus of the heat dissipation field, leading the innovation of technology and breakthroughs in industry applications.

The development history of the High Power IGBT Cooling Plate is a history of continuous innovation in pursuit of high - efficiency heat dissipation. Early cooling plate technologies were relatively simple, mainly adopting air - cooling or single - liquid - cooling methods, with limited heat dissipation efficiency and difficulty in meeting the growing high - power demands. With the continuous progress of materials science and manufacturing processes, new materials and innovative design concepts have been widely applied in the research and development of cooling plates.

For example, in terms of materials, high - performance composite materials such as aluminum silicon carbide (AlSiC) have gradually emerged. AlSiC has high thermal conductivity and good thermal expansion matching characteristics with semiconductor chips, which can effectively improve heat dissipation performance and prevent device damage caused by thermal stress. Its low density and high specific stiffness make it perform outstandingly in application scenarios with strict requirements for weight and seismic performance, such as the aerospace and rail transportation industries.

In terms of manufacturing processes, the application of advanced technologies such as friction stir welding and vacuum brazing has made the internal flow channel design of the cooling plate more refined, and the flow of the coolant more uniform, thus greatly improving the heat dissipation efficiency. In addition, the development of micro - channel cooling technology, by constructing a micro - flow channel structure inside the cooling plate, increases the contact area between the coolant and the heating device, further enhancing the heat dissipation effect.