It features high thermal conductivity and an adjustable coefficient of thermal expansion. This not only significantly enhances the heat - dissipation performance but also enables a good thermal expansion match with semiconductor chips and ceramic substrates, effectively preventing fatigue failure caused by thermal expansion differences. Power chips can be directly mounted on it. Its density is similar to that of aluminum, much lighter than materials like copper, making it highly advantageous in weight - sensitive fields such as portable devices and the aerospace industry. In addition, it has a high specific stiffness and better seismic performance than ceramics, making it an ideal choice for applications in harsh environments. Moreover, its relatively low cost has led to its increasingly widespread application in the market in recent years.

It adopts a variety of advanced technologies, such as vacuum or controlled - atmosphere brazed cold plates, friction - stir - welded finned cold plates, flat - tube cold plates, pressed - copper - tube cold plates, and copper cold plates. Its liquid - cooled plates are widely used in fields such as power electronics, electric vehicle batteries, data centers, medical equipment, lasers, and wind turbines. They can be customized according to user requirements, support the OEM/ODM model, and are 100% compliant with GB, SGS, and CE standards.